SEMIFIVE has signed a turnkey development contract with South Korea's Mobilint for an AI chip aimed at robotics. The project falls under the government-funded K-On-Device AI Semiconductor program, which supports the development and commercialization of chips for specific industries.
The processor is intended to handle AI computation on the robot itself, including outdoors where connections to external servers are limited. Agricultural robots are one proposed application, with cameras and sensors supplying data for real-time processing.
Development will follow SEMIFIVE's Spec Hand-off model. The customer defines performance targets and specifications, while SEMIFIVE takes responsibility for detailed design, packaging, testing and mass production.
Planned technologies include LPDDR6 memory, the PCIe Gen6 interface and UCIe-S interconnects. UCIe-S connects chiplets within a single package, allowing components with different functions to operate together.
The companies expect these technologies to support efficient computation and stable data handling without relying on continuous cloud access. They see the collaboration as a way to expand South Korea's AI semiconductor capabilities and develop new robotics platforms. The announcement does not specify a release date or numerical performance targets.